• AMPMODU II Pin Headers Economy Line

• AMPMODU IV/V Receptacle Housings

• AMPMODU IV Crimp Snap-In Contacts

• AMPMODU II Low Cost Line Pin Headers

• AMP HV-100/HV-190

• AMPMODU Pin Headers and HV-100 Receptacles for Surface Mount Assembly

• AMPMODU 2.0 mm SMD Pin Headers and Receptacles

AMPMODU II Pin Headers, Economy Line

• 2–50 Positions, with Retention Features

• Post Size 0.63 mm x 0.63 mm

• Single Row: Parallel stackable (on double row), Centerline 2.54 mm, Duplex Gold Plated

• Double Row: Parallel stackable, Centerline 2.54 mm, Duplex Gold Plated

• Right-Angle Post: Single/Double Row, Gold Plated

AMPMODU IV/V Receptacle Housings

• Material: Polyamide 6.6, green, per UL 94 V-HB

• 2–50 Positions

• With Retention Latch, Latching with the Pin Headers

• Single Row / Double Row

AMPMODU IV

• Crimp Snap-In Contacts

• Tandem-Spring-Contacts

• For 0.63 mm “Round” Post and 0.63 x 0.63 mm “Square” Post

AMPMODU II Low Cost Line

• Single Row (Vertical / Right-Angle), Duplex Gold Plated

• Double Row (Vertical / Right-Angle), Duplex Gold Plated

• 2-50 Positions

AMP HV-190

• Receptacles, Right-Angle Mount

• Centerline 2.54 mm – Stackable – End by End without Center Loss

• Side Entry, Single / Double Row

• 2-20 Positions

AMP HV-100

• Receptacles, Loaded

• Vertical Mount

• Centerline 2.54 mm – Stackable – Side by Side without Center Loss – True Closed Bottom –

• Top Entry, Single Row, Gold Plated Total Height 7.0 mm

• Top Entry, Double Row, Gold Plated Total Height 7.0 mm and 8.5 mm

• 2-16 Positions

AMPMODU Pin Headers and HV-100 Receptacles for Surface Mount Assembly

AMPMODU SMD pin headers and HV-100 receptacles are available in one and two row version with support tool for vacuum pick and place equipment.

Packaging in SMD carrier tape (DIN IEC 286) enables fully-automatic assembly. The fiber added material of the connector body allows soldering through infrared or vapor reflow.

The Gold-/AMP-DURAGOLD thickness in contact area is 0.8 µm over nickel. The solder posts are tin plated min. 2.5 µm over nickel.

Receptacles for top and bottom entry (bottom entry requires 1.2 mm holes in pcb).

AMPMODU SMD Pin Headers and Receptacles

• Double Row, 2.0 mm Centerline

• Post Size 0.5 x 0.5 mm

• Board-to-Board

  - Solder Version (not for SMD-Reflow)

  - Reduced Height, Integrated in PC Board, SMD-Version

  - Top and Bottom Entry, SMD-Version

  - Pin Header, SMD-Version

• Wire-to-Board

  - Crimp Contact AWG 24–28 / AWG 28–32

  - Receptacle Housing

  - Shroud

  - Pin Header, SMD-Version

• 4- to 24-Positions